Remote Plasma System - Chamber > PM Division

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PM Division

A Company Shaping the Future through New - LOTCES

Business Overview

The Plasma Division specializes in breaking down and neutralizing hazardous or environmentally harmful byproducts generated during semiconductor and display manufacturing processes. By utilizing plasma technology, we ensure safer emissions, enhancing workplace safety and operational stability.
Additionally, our solutions optimize pump usage cycles, contributing to improved semiconductor and display production yields and enhanced energy efficiency in manufacturing processes. We are committed to developing and producing innovative products that drive efficiency and sustainability in the industry.

Semiconductor Process Plasma Product Layout
PM_layout.jpg

Product Overview

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  • Remote Plasma System - Chamber

    In-Chamber Byproduct Removal System

    Details

    Designed to eliminate powder or metal-based byproducts within process chambers and pumps, extending MTBF and reducing PM cycles.

    - Utilizes remote plasma technology to generate F*(radicals)for byproduct removal


    ■ Technical Specifications

    - RF Power System : Max 10kW


    ■ Applicable Processes

    - Metal : W, WN, TiN

    - CVD : SiO2 (TEOS), ACL, Mold

    - Diff : EPI process

    LOTCES Co., Ltd. CEO : Kim Ho-sik Tel : +82-41-548-6540 Fax : +82-41-541-7540 Responsibility for personal information management : admin@lotces.com Head office : 1-20, Jigotjungang-ro, Osan-si, Gyeonggi-do, South Korea Branch : 62-5(Factory1) / 62-7(Factory2) Yeonamsan-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, South Korea

    Copyright © LOTCES. All Rights Reserved.